WHERE IDEAS COME TOGETHER
Surface Mount Technology (SMT) -
the surface placement of electronic components on one or both sides of a bare printed circuit board
using automated, precision
electronic robotics.
Through Hole –
the insertion of electronic
components with leads extending through the bare printed circuit board using axial insertion
automated though hole insertion technology (AI) or by hand
placement method.
Ball Grid Array (BGA) –
a high precision method of surface mount technology (SMT) using solder connections in a grid pattern.
BGA technology is used to
conduct electrical signals from the integrated circuit to the printed circuit board and is commonly employed where board space is limited.
Chip On Board (COB) -
a bare silicon chip or Integrated Circuit attached, often with epoxy, directly to a printed circuit board. The chip is then wire bonded and protected from mechanical
damage and contamination
by an epoxy “glob-top”.